Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits.  It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας: Lim, Sung Kyu (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2013.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
Πίνακας περιεχομένων:
  • Regular vs Irregular TSV Placementfor 3D IC
  • Steiner Routingfor 3D IC
  • Buffer Insertion for 3D IC.-  Low Power Clock Routing for 3D IC
  • Power Delivery Network Design for 3D IC
  • 3D Clock Routing for Pre-bond Testability
  • TSV-to-TSV Coupling Analysis and Optimization
  • TSV Current Crowding and Power Integrity
  • Modeling of Atomic Concentration at the Wire-to-TSV Interface
  • Multi-Objective Archetectural Floorplanning for 3D IC
  • Thermal-aware Gate-level Placement for 3D IC
  • 3D IC Cooling with Micro-Fluidic Channels
  • Mechanical Reliability Analysis and Optimization for 3D IC
  • Impact of Mechanical Stress on Timing Variation for 3D IC
  • Chip/Package Co-Analysis of Mechanical Stress for 3D IC
  • 3D Chip/Packaging Co-Analysis of Stress-Induced Timing Variations
  • TSV Interfracial Crack Analysis and Optimization
  • Ultra High Logic Designs Using Monolithic 3D Integration
  • Impact of TSV Scaling on 3D IC Design Quality
  • 3D-MAPS: 3DMassively Parallel Processor with Stacked Memory.