Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

• Κύριος συγγραφέας: Lim, Sung Kyu (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2013.
• Θέματα: Engineering.; Microprocessors.; Nanotechnology.; Electronic circuits.; Circuits and Systems.; Nanotechnology and Microengineering.; Processor Architectures.

This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits.  It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of...

Πίνακας περιεχομένων:

• Regular vs Irregular TSV Placementfor 3D IC
• Steiner Routingfor 3D IC
• Buffer Insertion for 3D IC.-  Low Power Clock Routing for 3D IC
• Power Delivery Network Design for 3D IC
• 3D Clock Routing for Pre-bond Testability
• TSV-to-TSV Coupling Analysis and Optimization
• TSV Current Crowding and Power Integrity
• Modeling of Atomic Concentration at the Wire-to-TSV Interface
• Multi-Objective Archetectural Floorplanning for 3D IC
• Thermal-aware Gate-level Placement for 3D IC
• 3D IC Cooling with Micro-Fluidic Channels
• Mechanical Reliability Analysis and Optimization for 3D IC
• Impact of Mechanical Stress on Timing Variation for 3D IC
• Chip/Package Co-Analysis of Mechanical Stress for 3D IC
• 3D Chip/Packaging Co-Analysis of Stress-Induced Timing Variations
• TSV Interfracial Crack Analysis and Optimization
• Ultra High Logic Designs Using Monolithic 3D Integration
• Impact of TSV Scaling on 3D IC Design Quality
• 3D-MAPS: 3DMassively Parallel Processor with Stacked Memory.