Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability /

• Main Authors: He, Ming (Author), Lu, Toh-Ming (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York, 2012.
• Series: Springer Series in Materials Science, 157
• Subjects: Engineering.; Electrochemistry.; Surfaces (Physics).; Interfaces (Physical sciences).; Thin films.; Thermodynamics.; Heat engineering.; Heat transfer.; Mass transfer.; Nanotechnology.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Surface and Interface Science, Thin Films.; Nanotechnology and Microengineering.; Engineering Thermodynamics, Heat and Mass Transfer.

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the a...