Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability /

• Main Authors: He, Ming (Author), Lu, Toh-Ming (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York, 2012.
• Series: Springer Series in Materials Science, 157
• Subjects: Engineering.; Electrochemistry.; Surfaces (Physics).; Interfaces (Physical sciences).; Thin films.; Thermodynamics.; Heat engineering.; Heat transfer.; Mass transfer.; Nanotechnology.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Surface and Interface Science, Thin Films.; Nanotechnology and Microengineering.; Engineering Thermodynamics, Heat and Mass Transfer.

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the a...

Table of Contents:

• Preface
• 1. Introduction
• 2. Metal-Dielectric Diffusion Processes: Fundamentals
• 3. Experimental Techniques
• 4. Al-Dielectric Interfaces
• 5. Cu-Dielectric Interfaces
• 6. Barrier Metal-Dielectric Interfaces
• 7. Self-Forming Barriers. 8. Kinetics of Ion Drift
• 9. Time-Dependent Dielectric Breakdown (TDDB) and Future Directions.