Packaging of High Power Semiconductor Lasers
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in hi...
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Bibliographic Details
| Main Authors: |
Liu, Xingsheng
(Author),
Zhao, Wei
(Author),
Xiong, Lingling
(Author),
Liu, Hui
(Author) |
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| Corporate Author: |
SpringerLink (Online service) |
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| Format: | Electronic
eBook
|
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| Language: | English |
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| Published: |
New York, NY :
Springer New York : Imprint: Springer,
2015.
|
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| Series: | Micro- and Opto-Electronic Materials, Structures, and Systems
|
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| Subjects: | |
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| Online Access: | Full Text via HEAL-Link
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