Factors Governing Tin Whisker Growth

• Main Author: Crandall, Erika R. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2013.
• Series: Springer Theses, Recognizing Outstanding Ph.D. Research,
• Subjects: Physics.; Surfaces (Physics).; Interfaces (Physical sciences).; Thin films.; Electronic circuits.; Metals.; Materials > Surfaces.; Electronic Circuits and Devices.; Circuits and Systems.; Metallic Materials.; Surfaces and Interfaces, Thin Films.; Surface and Interface Science, Thin Films.

Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (...