SpringerLink (Online service), Elfadel, I. M., & Fettweis, G. (2016). 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. Springer International Publishing : Imprint: Springer.
Chicago Style (17th ed.) CitationSpringerLink (Online service), Ibrahim M. Elfadel, and Gerhard Fettweis. 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. Cham: Springer International Publishing : Imprint: Springer, 2016.
MLA (8th ed.) CitationSpringerLink (Online service), et al. 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. Springer International Publishing : Imprint: Springer, 2016.
Warning: These citations may not always be 100% accurate.
