Παραπομπή σε μορφή APA (7η εκδ.)

SpringerLink (Online service), Elfadel, I. M., & Fettweis, G. (2016). 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. Springer International Publishing : Imprint: Springer.

Παραπομπή σε μορφή Chicago (17η εκδ.)

SpringerLink (Online service), Ibrahim M. Elfadel, και Gerhard Fettweis. 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. Cham: Springer International Publishing : Imprint: Springer, 2016.

Παραπομπή σε μορφή MLA (8th εκδ.)

SpringerLink (Online service), et al. 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. Springer International Publishing : Imprint: Springer, 2016.