3D Stacked Chips From Emerging Processes to Heterogeneous Systems /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Elfadel, Ibrahim (Abe) M. (Editor), Fettweis, Gerhard (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2016.
• Subjects: Engineering.; Microprocessors.; Electronic circuits.; Circuits and Systems.; Electronic Circuits and Devices.; Processor Architectures.

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus...