3D Stacked Chips From Emerging Processes to Heterogeneous Systems /

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Elfadel, Ibrahim (Abe) M. (Επιμελητής έκδοσης), Fettweis, Gerhard (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2016.
• Θέματα: Engineering.; Microprocessors.; Electronic circuits.; Circuits and Systems.; Electronic Circuits and Devices.; Processor Architectures.

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus...

Πίνακας περιεχομένων:

• Introduction to Electrical 3D Integration
• Copper-based TSV – Interposer
• Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization
• Energy Efficient Electrical Intra-Chip Stack Communication
• Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks
• Energy Efficient Communications Employing 1-Bit Quantization at the Receiver
• 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications
• Accurate Temperature Measurement for 3D Thermal Management
• EDA Environments for 3D Chip Stacks
• Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias
• Introduction to Optical Inter- and Intraconnects
• Optical Through-Silicon Vias
• Integrated Optical Devices for 3D Photonic Transceivers
• Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators
• Athermal photonic circuits for optical on-chip interconnects
• Integrated Circuits for 3D Photonic Transceivers
• Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-.