3D Microelectronic Packaging From Fundamentals to Applications /

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Li, Yan (Επιμελητής έκδοσης), Goyal, Deepak (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Σειρά: Springer Series in Advanced Microelectronics, 57
• Θέματα: Engineering.; Biotechnology.; Electronic circuits.; Nanotechnology.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Metals.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Electronic Circuits and Devices.; Microengineering.; Nanotechnology and Microengineering.; Metallic Materials.

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the...