SpringerLink (Online service), Li, Y., & Goyal, D. (2017). 3D Microelectronic Packaging: From Fundamentals to Applications. Springer International Publishing : Imprint: Springer.
Chicago Style (17th ed.) CitationSpringerLink (Online service), Yan Li, and Deepak Goyal. 3D Microelectronic Packaging: From Fundamentals to Applications. Cham: Springer International Publishing : Imprint: Springer, 2017.
MLA (8th ed.) CitationSpringerLink (Online service), et al. 3D Microelectronic Packaging: From Fundamentals to Applications. Springer International Publishing : Imprint: Springer, 2017.
Warning: These citations may not always be 100% accurate.
