Παραπομπή σε μορφή APA (7η εκδ.)

SpringerLink (Online service), Li, Y., & Goyal, D. (2017). 3D Microelectronic Packaging: From Fundamentals to Applications. Springer International Publishing : Imprint: Springer.

Παραπομπή σε μορφή Chicago (17η εκδ.)

SpringerLink (Online service), Yan Li, και Deepak Goyal. 3D Microelectronic Packaging: From Fundamentals to Applications. Cham: Springer International Publishing : Imprint: Springer, 2017.

Παραπομπή σε μορφή MLA (8th εκδ.)

SpringerLink (Online service), et al. 3D Microelectronic Packaging: From Fundamentals to Applications. Springer International Publishing : Imprint: Springer, 2017.