3D Microelectronic Packaging From Fundamentals to Applications /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Li, Yan (Editor), Goyal, Deepak (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Series: Springer Series in Advanced Microelectronics, 57
• Subjects: Engineering.; Biotechnology.; Electronic circuits.; Nanotechnology.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Metals.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Electronic Circuits and Devices.; Microengineering.; Nanotechnology and Microengineering.; Metallic Materials.

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the...