3D Microelectronic Packaging From Fundamentals to Applications /
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the...
| Συγγραφή απο Οργανισμό/Αρχή: | |
|---|---|
| Άλλοι συγγραφείς: | , |
| Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
Cham :
Springer International Publishing : Imprint: Springer,
2017.
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| Σειρά: | Springer Series in Advanced Microelectronics,
57 |
| Θέματα: | |
| Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV
- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging
- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages
- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging
- Fundamentals of advanced materials and processes in organic substrate technology
- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization
- Processing and Reliability of Solder Interconnections in Stacked Packaging
- Interconnect Quality and Reliability of 3D Packaging
- Fault isolation and failure analysis of 3D packaging. .
