RF and Microwave Microelectronics Packaging II

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Kuang, Ken (Επιμελητής έκδοσης), Sturdivant, Rick (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Θέματα: Engineering.; Microwaves.; Optical engineering.; Electronics.; Microelectronics.; Electronic circuits.; Electronics and Microelectronics, Instrumentation.; Microwaves, RF and Optical Engineering.; Circuits and Systems.

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...