Παραπομπή σε μορφή APA (7η εκδ.)

SpringerLink (Online service), Kuang, K., & Sturdivant, R. (2017). RF and Microwave Microelectronics Packaging II. Springer International Publishing : Imprint: Springer.

Παραπομπή σε μορφή Chicago (17η εκδ.)

SpringerLink (Online service), Ken Kuang, και Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Cham: Springer International Publishing : Imprint: Springer, 2017.

Παραπομπή σε μορφή MLA (8th εκδ.)

SpringerLink (Online service), et al. RF and Microwave Microelectronics Packaging II. Springer International Publishing : Imprint: Springer, 2017.