SpringerLink (Online service), Kuang, K., & Sturdivant, R. (2017). RF and Microwave Microelectronics Packaging II. Springer International Publishing : Imprint: Springer.
Chicago Style (17th ed.) CitationSpringerLink (Online service), Ken Kuang, and Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Cham: Springer International Publishing : Imprint: Springer, 2017.
MLA (8th ed.) CitationSpringerLink (Online service), et al. RF and Microwave Microelectronics Packaging II. Springer International Publishing : Imprint: Springer, 2017.
Warning: These citations may not always be 100% accurate.
