RF and Microwave Microelectronics Packaging II

• Corporate Author: SpringerLink (Online service)
• Other Authors: Kuang, Ken (Editor), Sturdivant, Rick (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Subjects: Engineering.; Microwaves.; Optical engineering.; Electronics.; Microelectronics.; Electronic circuits.; Electronics and Microelectronics, Instrumentation.; Microwaves, RF and Optical Engineering.; Circuits and Systems.

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...