RF and Microwave Microelectronics Packaging II

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Kuang, Ken (Επιμελητής έκδοσης), Sturdivant, Rick (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Θέματα: Engineering.; Microwaves.; Optical engineering.; Electronics.; Microelectronics.; Electronic circuits.; Electronics and Microelectronics, Instrumentation.; Microwaves, RF and Optical Engineering.; Circuits and Systems.

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...

Πίνακας περιεχομένων:

• Chapter1. Introduction to RF and Microwave Microelectronic Packaging
• Chapter2. Packaging of Transmit/Receive Modules
• Chapter3. 3D Transitions and Connections
• Chapter4. Electromagnetic Shielding for RF & Microwave Packages
• Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate
• Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package
• Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices
• Chapter8. The challenge in packaging and assembly the advanced power amplifiers
• Chapter9. High Thermal Conductivity Materials – Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond
• Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging
• Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging.