Testing of Interposer-Based 2.5D Integrated Circuits

• Main Authors: Wang, Ran (Author), Chakrabarty, Krishnendu (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Subjects: Engineering.; Logic design.; Microprocessors.; Electronic circuits.; Circuits and Systems.; Processor Architectures.; Logic Design.

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,...