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03258nam a22004695i 4500 |
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978-3-319-54714-5 |
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20170320133608.0 |
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170320s2017 gw | s |||| 0|eng d |
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|a 9783319547145
|9 978-3-319-54714-5
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|a 10.1007/978-3-319-54714-5
|2 doi
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|a 621.3815
|2 23
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|a Wang, Ran.
|e author.
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|a Testing of Interposer-Based 2.5D Integrated Circuits
|h [electronic resource] /
|c by Ran Wang, Krishnendu Chakrabarty.
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|a Cham :
|b Springer International Publishing :
|b Imprint: Springer,
|c 2017.
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|a XIV, 182 p. 118 illus., 102 illus. in color.
|b online resource.
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|a text
|b txt
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|a computer
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|a online resource
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|a text file
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|a Introduction -- Pre-Bond Testing of the Silicon Interposer -- Post-Bond Scan-based Testing of Interposer Interconnects -- Test Architecture and Test-Path Scheduling -- Built-In Self-Test -- ExTest Scheduling and Optimization -- A Programmable Method for Low-Power Scan Shift in SoC Dies -- Conclusions.-.
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|a This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Provides a single-source guide to the practical challenges in testing of 2.5D ICs; Presents an efficient method to locate defects in a passive interposer before stacking; Describes an efficient interconnect-test solution to target through-silicon vias (TSVs), the redistribution layer, and micro-bumps for shorts, opens, and delay faults; Provides a built-in self-test (BIST) architecture that can be enabled by the standard TAP controller in the IEEE 1149.1 standard; Discusses two ExTest scheduling strategies to implement interconnect testing between tiles inside an SoC die; Includes a programmable method for shift-clock stagger assignment to reduce power supply noise during SoC die testing in 2.5D ICs.
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|a Engineering.
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|a Logic design.
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|a Microprocessors.
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|a Electronic circuits.
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|a Engineering.
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|a Circuits and Systems.
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|a Processor Architectures.
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|a Logic Design.
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|a Chakrabarty, Krishnendu.
|e author.
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|a SpringerLink (Online service)
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|t Springer eBooks
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|i Printed edition:
|z 9783319547138
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|u http://dx.doi.org/10.1007/978-3-319-54714-5
|z Full Text via HEAL-Link
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|a ZDB-2-ENG
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|a Engineering (Springer-11647)
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