Testing of Interposer-Based 2.5D Integrated Circuits

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,...

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Bibliographic Details
Main Authors: Wang, Ran (Author), Chakrabarty, Krishnendu (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
Subjects:
Online Access:Full Text via HEAL-Link
LEADER 03258nam a22004695i 4500
001 978-3-319-54714-5
003 DE-He213
005 20170320133608.0
007 cr nn 008mamaa
008 170320s2017 gw | s |||| 0|eng d
020 |a 9783319547145  |9 978-3-319-54714-5 
024 7 |a 10.1007/978-3-319-54714-5  |2 doi 
040 |d GrThAP 
050 4 |a TK7888.4 
072 7 |a TJFC  |2 bicssc 
072 7 |a TEC008010  |2 bisacsh 
082 0 4 |a 621.3815  |2 23 
100 1 |a Wang, Ran.  |e author. 
245 1 0 |a Testing of Interposer-Based 2.5D Integrated Circuits  |h [electronic resource] /  |c by Ran Wang, Krishnendu Chakrabarty. 
264 1 |a Cham :  |b Springer International Publishing :  |b Imprint: Springer,  |c 2017. 
300 |a XIV, 182 p. 118 illus., 102 illus. in color.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a Introduction -- Pre-Bond Testing of the Silicon Interposer -- Post-Bond Scan-based Testing of Interposer Interconnects -- Test Architecture and Test-Path Scheduling -- Built-In Self-Test -- ExTest Scheduling and Optimization -- A Programmable Method for Low-Power Scan Shift in SoC Dies -- Conclusions.-. 
520 |a This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Provides a single-source guide to the practical challenges in testing of 2.5D ICs; Presents an efficient method to locate defects in a passive interposer before stacking; Describes an efficient interconnect-test solution to target through-silicon vias (TSVs), the redistribution layer, and micro-bumps for shorts, opens, and delay faults; Provides a built-in self-test (BIST) architecture that can be enabled by the standard TAP controller in the IEEE 1149.1 standard; Discusses two ExTest scheduling strategies to implement interconnect testing between tiles inside an SoC die; Includes a programmable method for shift-clock stagger assignment to reduce power supply noise during SoC die testing in 2.5D ICs. 
650 0 |a Engineering. 
650 0 |a Logic design. 
650 0 |a Microprocessors. 
650 0 |a Electronic circuits. 
650 1 4 |a Engineering. 
650 2 4 |a Circuits and Systems. 
650 2 4 |a Processor Architectures. 
650 2 4 |a Logic Design. 
700 1 |a Chakrabarty, Krishnendu.  |e author. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9783319547138 
856 4 0 |u http://dx.doi.org/10.1007/978-3-319-54714-5  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647)