Testing of Interposer-Based 2.5D Integrated Circuits
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,...
Κύριοι συγγραφείς: | Wang, Ran (Συγγραφέας), Chakrabarty, Krishnendu (Συγγραφέας) |
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Συγγραφή απο Οργανισμό/Αρχή: | SpringerLink (Online service) |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Cham :
Springer International Publishing : Imprint: Springer,
2017.
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Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
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