Testing of Interposer-Based 2.5D Integrated Circuits

• Κύριοι συγγραφείς: Wang, Ran (Συγγραφέας), Chakrabarty, Krishnendu (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Θέματα: Engineering.; Logic design.; Microprocessors.; Electronic circuits.; Circuits and Systems.; Processor Architectures.; Logic Design.

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,...

Πίνακας περιεχομένων:

• Introduction
• Pre-Bond Testing of the Silicon Interposer
• Post-Bond Scan-based Testing of Interposer Interconnects
• Test Architecture and Test-Path Scheduling
• Built-In Self-Test
• ExTest Scheduling and Optimization
• A Programmable Method for Low-Power Scan Shift in SoC Dies
• Conclusions.-.