Seok, S., & Seok, S. (2018). Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method (1st ed. 2018.). Springer International Publishing : Imprint: Springer. https://doi.org/10.1007/978-3-319-77872-3
Παραπομπή σε μορφή Chicago (17η εκδ.)Seok, Seonho, και Seonho Seok. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. 1st ed. 2018. Cham: Springer International Publishing : Imprint: Springer, 2018. https://doi.org/10.1007/978-3-319-77872-3.
Παραπομπή σε μορφή MLA (8th εκδ.)Seok, Seonho, και Seonho Seok. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. 1st ed. 2018. Springer International Publishing : Imprint: Springer, 2018. https://doi.org/10.1007/978-3-319-77872-3.
