Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding b...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας: Seok, Seonho (Συγγραφέας, http://id.loc.gov/vocabulary/relators/aut)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2018.
Έκδοση:1st ed. 2018.
Σειρά:Springer Series in Advanced Manufacturing,
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
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100 1 |a Seok, Seonho.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering  |h [electronic resource] :  |b Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /  |c by Seonho Seok. 
250 |a 1st ed. 2018. 
264 1 |a Cham :  |b Springer International Publishing :  |b Imprint: Springer,  |c 2018. 
300 |a VIII, 115 p. 106 illus.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Springer Series in Advanced Manufacturing,  |x 1860-5168 
505 0 |a Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. . 
520 |a This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. 
650 0 |a Manufactures. 
650 0 |a Nanotechnology. 
650 0 |a Materials science. 
650 0 |a Tribology. 
650 0 |a Corrosion and anti-corrosives. 
650 0 |a Coatings. 
650 1 4 |a Manufacturing, Machines, Tools, Processes.  |0 http://scigraph.springernature.com/things/product-market-codes/T22050 
650 2 4 |a Nanotechnology.  |0 http://scigraph.springernature.com/things/product-market-codes/Z14000 
650 2 4 |a Nanotechnology and Microengineering.  |0 http://scigraph.springernature.com/things/product-market-codes/T18000 
650 2 4 |a Characterization and Evaluation of Materials.  |0 http://scigraph.springernature.com/things/product-market-codes/Z17000 
650 2 4 |a Tribology, Corrosion and Coatings.  |0 http://scigraph.springernature.com/things/product-market-codes/Z15000 
710 2 |a SpringerLink (Online service) 
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776 0 8 |i Printed edition:  |z 9783319778716 
776 0 8 |i Printed edition:  |z 9783319778730 
776 0 8 |i Printed edition:  |z 9783030085612 
830 0 |a Springer Series in Advanced Manufacturing,  |x 1860-5168 
856 4 0 |u https://doi.org/10.1007/978-3-319-77872-3  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647)