Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /

• Main Author: Seok, Seonho (Author, http://id.loc.gov/vocabulary/relators/aut)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2018.
• Edition: 1st ed. 2018.
• Series: Springer Series in Advanced Manufacturing,
• Subjects: Manufactures.; Nanotechnology.; Materials science.; Tribology.; Corrosion and anti-corrosives.; Coatings.; Manufacturing, Machines, Tools, Processes.; Nanotechnology and Microengineering.; Characterization and Evaluation of Materials.; Tribology, Corrosion and Coatings.

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding b...

Table of Contents:

• Overview of MEMS packaging technologies
• Adhesion control techniques for debonding
• FEM modeling of debonding
• Polymer cap transfer packaging technologies
• Thin film cap transfer packaging technology
• Other related manufacturing technologies. .