Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Gerlach, Gerald (Editor), Wolter, Klaus-Jürgen (Editor)
• Format: Electronic eBook
• Language: English
• Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2012.
• Subjects: Materials science.; Optical materials.; Electronic materials.; Nanotechnology.; Materials Science.; Optical and Electronic Materials.; Characterization and Evaluation of Materials.

The book offers a comprehensive discussion of future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes effects of nano-sized particles and cell-based approaches for packaging solutions with their diverse requiremen...

Table of Contents:

• General Aspects
• 3D Modelling and Design for Nems
• Nanoparticles
• Nanopatterning
• Metallization
• Nano- and Bio-Functionalized Surfaces
• Biocompatible Packaging
• Thermal Management
• System-In-Package For Mems and Moems.