Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System

• Main Author: Samukawa, Seiji (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Tokyo : Springer Japan : Imprint: Springer, 2014.
• Series: SpringerBriefs in Applied Sciences and Technology,
• Subjects: Engineering.; Plasma (Ionized gases).; Nanoscale science.; Nanoscience.; Nanostructures.; Semiconductors.; Nanotechnology.; Nanotechnology and Microengineering.; Nanoscale Science and Technology.; Plasma Physics.

This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of re...

Table of Contents:

• Introduction
• On-wafer UV sensor and prediction of UV irradiation damage
• Prediction of Abnormal Etching Profiles in High-aspect-ratio Via/Hole Etching Using On-wafer Monitoring System
• Feature Profile Evolution in Plasma Processing Using Wireless On-wafer Monitoring System.