Electrical Design of Through Silicon Via

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Lee, Manho (Επιμελητής έκδοσης), Pak, Jun So (Επιμελητής έκδοσης), Kim, Joungho (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Dordrecht : Springer Netherlands : Imprint: Springer, 2014.
• Θέματα: Engineering.; Special purpose computers.; Electronic circuits.; Circuits and Systems.; Electronic Circuits and Devices.; Special Purpose and Application-Based Systems.

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints...