Παραπομπή σε μορφή APA (7η εκδ.)

SpringerLink (Online service), Lee, M., Pak, J. S., & Kim, J. (2014). Electrical Design of Through Silicon Via. Springer Netherlands : Imprint: Springer.

Παραπομπή σε μορφή Chicago (17η εκδ.)

SpringerLink (Online service), Manho Lee, Jun So Pak, και Joungho Kim. Electrical Design of Through Silicon Via. Dordrecht: Springer Netherlands : Imprint: Springer, 2014.

Παραπομπή σε μορφή MLA (8th εκδ.)

SpringerLink (Online service), et al. Electrical Design of Through Silicon Via. Springer Netherlands : Imprint: Springer, 2014.