Electrical Design of Through Silicon Via

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Lee, Manho (Επιμελητής έκδοσης), Pak, Jun So (Επιμελητής έκδοσης), Kim, Joungho (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Dordrecht : Springer Netherlands : Imprint: Springer, 2014.
• Θέματα: Engineering.; Special purpose computers.; Electronic circuits.; Circuits and Systems.; Electronic Circuits and Devices.; Special Purpose and Application-Based Systems.
• Φυσική περιγραφή: IX, 280 p. 249 illus. online resource.
• ISBN: 9789401790383

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.