Electrical Design of Through Silicon Via
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints...
Συγγραφή απο Οργανισμό/Αρχή: | SpringerLink (Online service) |
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Άλλοι συγγραφείς: | Lee, Manho (Επιμελητής έκδοσης), Pak, Jun So (Επιμελητής έκδοσης), Kim, Joungho (Επιμελητής έκδοσης) |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Dordrecht :
Springer Netherlands : Imprint: Springer,
2014.
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Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
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