Electrical Design of Through Silicon Via

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Lee, Manho (Επιμελητής έκδοσης), Pak, Jun So (Επιμελητής έκδοσης), Kim, Joungho (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Dordrecht : Springer Netherlands : Imprint: Springer, 2014.
• Θέματα: Engineering.; Special purpose computers.; Electronic circuits.; Circuits and Systems.; Electronic Circuits and Devices.; Special Purpose and Application-Based Systems.

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints...

Πίνακας περιεχομένων:

• Preface
• 1 Introduction
• 2 Electrical Modeling of a Through-Silicon Via (TSV)
• 3 High-speed TSV-based Channel Modeling and Design
• 4 Noise Coupling and Shielding in 3D ICs
• 5 Thermal Effects on TSV Signal Integrity
• 6 Power Distribution Network (PDN) Modeling and Analysis for TSV and Interposer-based 3D-ICs in the Frequency Domain
• 7 TSV Decoupling Schemes
• Index.