Electromigration Modeling at Circuit Layout Level

• Main Authors: Tan, Cher Ming (Author), He, Feifei (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Singapore : Springer Singapore : Imprint: Springer, 2013.
• Series: SpringerBriefs in Applied Sciences and Technology,
• Subjects: Engineering.; Atoms.; Physics.; Electronic circuits.; Quality control.; Reliability.; Industrial safety.; Quality Control, Reliability, Safety and Risk.; Electronic Circuits and Devices.; Atomic, Molecular, Optical and Plasma Physics.

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has...