Electromigration Modeling at Circuit Layout Level

• Κύριοι συγγραφείς: Tan, Cher Ming (Συγγραφέας), He, Feifei (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Singapore : Springer Singapore : Imprint: Springer, 2013.
• Σειρά: SpringerBriefs in Applied Sciences and Technology,
• Θέματα: Engineering.; Atoms.; Physics.; Electronic circuits.; Quality control.; Reliability.; Industrial safety.; Quality Control, Reliability, Safety and Risk.; Electronic Circuits and Devices.; Atomic, Molecular, Optical and Plasma Physics.

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has...