Electromigration Modeling at Circuit Layout Level

• Main Authors: Tan, Cher Ming (Author), He, Feifei (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Singapore : Springer Singapore : Imprint: Springer, 2013.
• Series: SpringerBriefs in Applied Sciences and Technology,
• Subjects: Engineering.; Atoms.; Physics.; Electronic circuits.; Quality control.; Reliability.; Industrial safety.; Quality Control, Reliability, Safety and Risk.; Electronic Circuits and Devices.; Atomic, Molecular, Optical and Plasma Physics.

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has...

Table of Contents:

• Introduction
• 3D Circuit Model Construction and Simulation
• Comparison of EM Performance in Circuit Structure and Test Structure
• Interconnect EM Reliability Modeling at Circuit Layout Level
• Conclusion.