Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing /

• Main Author: Liu, S. (Sheng), 1963-
• Corporate Author: Wiley InterScience (Online service)
• Other Authors: Liu, Yong, 1962-
• Format: eBook
• Language: English
• Published: Hoboken, N.J. : Wiley, 2011.
• Subjects: Microelectronic packaging > Simulation methods.; TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.; Electronic books.

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--