Παραπομπή σε μορφή APA (7η εκδ.)

Liu, S., & Liu, Y. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacture, reliability, and testing. Wiley. https://doi.org/10.1002/9780470827826

Παραπομπή σε μορφή Chicago (17η εκδ.)

Liu, S., και Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacture, Reliability, and Testing. Hoboken, N.J.: Wiley, 2011. https://doi.org/10.1002/9780470827826.

Παραπομπή σε μορφή MLA (8th εκδ.)

Liu, S., και Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacture, Reliability, and Testing. Wiley, 2011. https://doi.org/10.1002/9780470827826.