APA (7th ed.) Citation

Liu, S., & Liu, Y. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacture, reliability, and testing. Wiley. https://doi.org/10.1002/9780470827826

Chicago Style (17th ed.) Citation

Liu, S., and Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacture, Reliability, and Testing. Hoboken, N.J.: Wiley, 2011. https://doi.org/10.1002/9780470827826.

MLA (8th ed.) Citation

Liu, S., and Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacture, Reliability, and Testing. Wiley, 2011. https://doi.org/10.1002/9780470827826.