Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--
| Κύριος συγγραφέας: | |
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| Συγγραφή απο Οργανισμό/Αρχή: | |
| Άλλοι συγγραφείς: | |
| Μορφή: | Ηλ. βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
Hoboken, N.J. :
Wiley,
2011.
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| Θέματα: | |
| Διαθέσιμο Online: | Full Text via HEAL-Link |
| Περίληψη: | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."-- |
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| Φυσική περιγραφή: | 1 online resource (xxi, 564 pages) : illustrations (some color) |
| Βιβλιογραφία: | Includes bibliographical references and index. |
| ISBN: | 9780470827826 0470827823 |
| DOI: | 10.1002/9780470827826 |
