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03305nam a2200457 4500 |
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ocn757511518 |
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OCoLC |
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20170124071714.5 |
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m o d |
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cr cn||||||||| |
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111018s2011 njua ob 001 0 eng d |
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|a DG1
|b eng
|c DG1
|d MYG
|d YDXCP
|d OCLCQ
|d OCLCA
|d OCLCQ
|d DEBBG
|d GrThAP
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| 020 |
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|a 9780470827826
|q (electronic bk.)
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| 020 |
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|a 0470827823
|q (electronic bk.)
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|a NZ1
|b 14145822
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|a NZ1
|b 15340662
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|a DEBBG
|b BV043393584
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| 035 |
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|a (OCoLC)757511518
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| 037 |
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|a 10.1002/9780470827826
|b Wiley InterScience
|n http://www3.interscience.wiley.com
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1 |
4 |
|a TK7870.15
|b .L58 2011eb
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| 082 |
0 |
4 |
|a 621.381/046
|2 23
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| 049 |
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|a MAIN
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| 100 |
1 |
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|a Liu, S.
|q (Sheng),
|d 1963-
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| 245 |
1 |
0 |
|a Modeling and simulation for microelectronic packaging assembly :
|b manufacture, reliability, and testing /
|c Sheng Liu, Yong Liu.
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| 264 |
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1 |
|a Hoboken, N.J. :
|b Wiley,
|c 2011.
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| 300 |
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|a 1 online resource (xxi, 564 pages) :
|b illustrations (some color)
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| 336 |
|
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|a text
|b txt
|2 rdacontent
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| 337 |
|
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 505 |
0 |
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|a Front Matter -- Mechanics and Modeling. Constitutive Models and Finite Element Method -- Material and Structural Testing for Small Samples -- Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution -- Accelerated Fatigue Life Assessment Approaches for Solders in Packages -- Multi-Physics and Multi-Scale Modeling -- Modeling Validation Tools -- Application of Fracture Mechanics -- Concurrent Engineering for Microelectronics -- Modeling in Microelectronic Packaging and Assembly. Typical IC Packaging and Assembly Processes -- Opto Packaging and Assembly -- MEMS and MEMS Package Assembly -- System in Package (SIP) Assembly -- Modeling in Microelectronic Package Reliability and Test. Wafer Probing Test -- Power and Thermal Cycling, Solder Joint Fatigue Life -- Passivation Crack Avoidance -- Drop Test -- Electromigration -- Popcorning in Plastic Packages -- Modern Modeling and Simulation Methodologies: Application to Nano Packaging. Classical Molecular Dynamics -- Index.
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| 520 |
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|a "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--
|c Provided by publisher.
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| 504 |
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|a Includes bibliographical references and index.
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| 533 |
|
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|a Electronic reproduction.
|b Hoboken, N.J. :
|c Wiley InterScience,
|d 2011.
|n Mode of access: World Wide Web.
|n System requirements: Web browser.
|n Title from title screen (viewed on Oct. 4, 2011).
|n Access may be restricted to users at subscribing institutions.
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| 650 |
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|a Microelectronic packaging
|x Simulation methods.
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| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Circuits
|x General.
|2 bisacsh
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| 655 |
|
4 |
|a Electronic books.
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| 700 |
1 |
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|a Liu, Yong,
|d 1962-
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| 710 |
2 |
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|a Wiley InterScience (Online service)
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| 776 |
0 |
8 |
|i Print version:
|a Liu, S. (Sheng), 1963-
|t Modeling and simulation for microelectronic packaging assembly.
|d Hoboken, N.J. : Wiley, 2011
|z 9780470827802
|w (DLC) 2011019534
|w (OCoLC)699765387
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| 856 |
4 |
0 |
|u https://doi.org/10.1002/9780470827826
|z Full Text via HEAL-Link
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| 994 |
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|a 92
|b DG1
|
