Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--
Κύριος συγγραφέας: | Liu, S. (Sheng), 1963- |
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Συγγραφή απο Οργανισμό/Αρχή: | Wiley InterScience (Online service) |
Άλλοι συγγραφείς: | Liu, Yong, 1962- |
Μορφή: | Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Hoboken, N.J. :
Wiley,
2011.
|
Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
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