Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--
Κύριος συγγραφέας: | |
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Συγγραφή απο Οργανισμό/Αρχή: | |
Άλλοι συγγραφείς: | |
Μορφή: | Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Hoboken, N.J. :
Wiley,
2011.
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Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Front Matter
- Mechanics and Modeling. Constitutive Models and Finite Element Method
- Material and Structural Testing for Small Samples
- Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution
- Accelerated Fatigue Life Assessment Approaches for Solders in Packages
- Multi-Physics and Multi-Scale Modeling
- Modeling Validation Tools
- Application of Fracture Mechanics
- Concurrent Engineering for Microelectronics
- Modeling in Microelectronic Packaging and Assembly. Typical IC Packaging and Assembly Processes
- Opto Packaging and Assembly
- MEMS and MEMS Package Assembly
- System in Package (SIP) Assembly
- Modeling in Microelectronic Package Reliability and Test. Wafer Probing Test
- Power and Thermal Cycling, Solder Joint Fatigue Life
- Passivation Crack Avoidance
- Drop Test
- Electromigration
- Popcorning in Plastic Packages
- Modern Modeling and Simulation Methodologies: Application to Nano Packaging. Classical Molecular Dynamics
- Index.