Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing /

• Κύριος συγγραφέας: Liu, S. (Sheng), 1963-
• Συγγραφή απο Οργανισμό/Αρχή: Wiley InterScience (Online service)
• Άλλοι συγγραφείς: Liu, Yong, 1962-
• Μορφή: Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Hoboken, N.J. : Wiley, 2011.
• Θέματα: Microelectronic packaging > Simulation methods.; TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.; Electronic books.

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--

Πίνακας περιεχομένων:

• Front Matter
• Mechanics and Modeling. Constitutive Models and Finite Element Method
• Material and Structural Testing for Small Samples
• Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution
• Accelerated Fatigue Life Assessment Approaches for Solders in Packages
• Multi-Physics and Multi-Scale Modeling
• Modeling Validation Tools
• Application of Fracture Mechanics
• Concurrent Engineering for Microelectronics
• Modeling in Microelectronic Packaging and Assembly. Typical IC Packaging and Assembly Processes
• Opto Packaging and Assembly
• MEMS and MEMS Package Assembly
• System in Package (SIP) Assembly
• Modeling in Microelectronic Package Reliability and Test. Wafer Probing Test
• Power and Thermal Cycling, Solder Joint Fatigue Life
• Passivation Crack Avoidance
• Drop Test
• Electromigration
• Popcorning in Plastic Packages
• Modern Modeling and Simulation Methodologies: Application to Nano Packaging. Classical Molecular Dynamics
• Index.