Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας: Liu, S. (Sheng), 1963-
Συγγραφή απο Οργανισμό/Αρχή: Wiley InterScience (Online service)
Άλλοι συγγραφείς: Liu, Yong, 1962-
Μορφή: Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Hoboken, N.J. : Wiley, 2011.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
Πίνακας περιεχομένων:
  • Front Matter
  • Mechanics and Modeling. Constitutive Models and Finite Element Method
  • Material and Structural Testing for Small Samples
  • Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution
  • Accelerated Fatigue Life Assessment Approaches for Solders in Packages
  • Multi-Physics and Multi-Scale Modeling
  • Modeling Validation Tools
  • Application of Fracture Mechanics
  • Concurrent Engineering for Microelectronics
  • Modeling in Microelectronic Packaging and Assembly. Typical IC Packaging and Assembly Processes
  • Opto Packaging and Assembly
  • MEMS and MEMS Package Assembly
  • System in Package (SIP) Assembly
  • Modeling in Microelectronic Package Reliability and Test. Wafer Probing Test
  • Power and Thermal Cycling, Solder Joint Fatigue Life
  • Passivation Crack Avoidance
  • Drop Test
  • Electromigration
  • Popcorning in Plastic Packages
  • Modern Modeling and Simulation Methodologies: Application to Nano Packaging. Classical Molecular Dynamics
  • Index.