Semiconductor laser engineering, reliability and diagnostics : a practical approach to high power and single mode devices /

"This reference book provides a fully integrated novel approach to the development of high power, single transverse mode, edge-emitting diode lasers by addressing the complementary topics of device engineering (Part 1), reliability engineering (Part 2) and device diagnostics (Part 3) in the sam...

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Bibliographic Details
Main Author: Epperlein, Peter W.
Format: eBook
Language:English
Published: Chichester, West Sussex, U.K. : John Wiley & Sons Inc., 2013.
Subjects:
Online Access:Full Text via HEAL-Link
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050 4 |a TA1700  |b .E67 2013eb 
072 7 |a TEC  |2 eflch 
082 0 4 |a 621.36/61  |2 23 
049 |a MAIN 
100 1 |a Epperlein, Peter W. 
245 1 0 |a Semiconductor laser engineering, reliability and diagnostics :  |b a practical approach to high power and single mode devices /  |c Peter W. Epperlein. 
264 1 |a Chichester, West Sussex, U.K. :  |b John Wiley & Sons Inc.,  |c 2013. 
300 |a 1 online resource (xxiv, 496 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
504 |a Includes bibliographical references and index. 
520 |a "This reference book provides a fully integrated novel approach to the development of high power, single transverse mode, edge-emitting diode lasers by addressing the complementary topics of device engineering (Part 1), reliability engineering (Part 2) and device diagnostics (Part 3) in the same book in altogether nine comprehensive chapters, and thus closes the gap in the current book literature. Diode laser fundamentals are discussed, followed by an elaborate discussion of problem-oriented design guidelines and techniques, and by a systematic treatment of the origins of laser degradation and a thorough exploration of the engineering means to address for effective remedies and enhanced optical strength. The discussion covers also stability criteria of critical laser characteristics and key laser robustness factors. Clear design considerations are discussed in the context of reliability engineering concepts and models, along with typical programs for reliability tests and laser product qualifications. A final extended part of novel, advanced diagnostic methods covers in detail, for the first time in book literature, performance- and reliability-impacting factors such as temperature, stress and material instabilities. Further key features include: Furnishes comprehensive practical design guidelines by considering also reliability related effects and key laser robustness factors, and discusses basic laser fabrication and packaging issues. Discusses in detail diagnostic investigations of diode lasers, the fundamentals of the applied approaches and techniques, many of them pioneered by the author to be fit-for-purpose and novel in the application. Provides a systematic insight into laser degradation modes such as catastrophic optical damage, and covers a wide range of technologies to increase the optical strength of diode lasers. Discusses basic concepts and techniques of laser reliability engineering, and provides for the first time in a book details on a standard commercial program for testing the reliabity of high power diode laser. Semiconductor Laser Engineering, Reliability and Diagnostics reflects the extensive expertise of the author in the diode laser field both as a top scientific researcher as well as a key developer of highly reliable devices. It features two hundred figures and tables illustrating numerous aspects of diode laser engineering, fabrication, packaging, reliability, performance, diagnostics and applications, and an extensive list of references to all addressed technical topics at the end of each chapter. With invaluable practical advice, this novel reference book is suited to practising researchers in diode laser technologies, and to postgraduate engineering students."--  |c Provided by publisher. 
505 0 |a Semiconductor Laser Engineering, Reliability and Diagnostics; Contents; Preface; About the author; PART 1 DIODE LASER ENGINEERING; Overview; 1 Basic diode laser engineering principles; Introduction; 1.1 Brief recapitulation; 1.1.1 Key features of a diode laser; 1.1.1.1 Carrier population inversion; 1.1.1.2 Net gain mechanism; 1.1.1.3 Optical resonator; 1.1.1.4 Transverse vertical confinement; 1.1.1.5 Transverse lateral confinement; 1.1.2 Homojunction diode laser; 1.1.3 Double-heterostructure diode laser; 1.1.4 Quantum well diode laser. 
505 8 |a 1.1.4.1 Advantages of quantum well heterostructures for diode lasersWavelength adjustment and tunability; Strained quantum well lasers; Optical power supply; Temperature characteristics; 1.1.5 Common compounds for semiconductor lasers; 1.2 Optical output power -- diverse aspects; 1.2.1 Approaches to high-power diode lasers; 1.2.1.1 Edge-emitters; 1.2.1.2 Surface-emitters; 1.2.2 High optical power considerations; 1.2.2.1 Laser brightness; 1.2.2.2 Laser beam quality factor M2; 1.2.3 Power limitations; 1.2.3.1 Kinks; 1.2.3.2 Rollover; 1.2.3.3 Catastrophic optical damage; 1.2.3.4 Aging. 
505 8 |a 1.3.4.3 Cavity length dependence1.3.4.4 Active layer thickness dependence; 1.3.5 Transverse vertical and transverse lateral modes; 1.3.5.1 Vertical confinement structures -- summary; Double-heterostructure; Single quantum well; Strained quantum well; Separate confinement heterostructure SCH and graded-index SCH (GRIN-SCH); Multiple quantum well (MQW); 1.3.5.2 Lateral confinement structures; Gain-guiding concept and key features; Weakly index-guiding concept and key features; Strongly index-guiding concept and key features; 1.3.5.3 Near-field and far-field pattern. 
505 8 |a 1.3.6 Fabry-Pérot longitudinal modes1.3.7 Operating characteristics; 1.3.7.1 Optical output power and efficiency; 1.3.7.2 Internal efficiency and optical loss measurements; 1.3.7.3 Temperature dependence of laser characteristics; 1.3.8 Mirror reflectivity modifications; 1.4 Laser fabrication technology; 1.4.1 Laser wafer growth; 1.4.1.1 Substrate specifications and preparation; 1.4.1.2 Substrate loading; 1.4.1.3 Growth; 1.4.2 Laser wafer processing; 1.4.2.1 Ridge waveguide etching and embedding; 1.4.2.2 The p-type electrode; 1.4.2.3 Ridge waveguide protection. 
650 0 |a Semiconductor lasers. 
650 4 |a Semiconductor lasers. 
650 4 |a Engineering. 
650 4 |a Laser engineering. 
650 7 |a TECHNOLOGY & ENGINEERING  |x Lasers & Photonics.  |2 bisacsh 
650 7 |a Semiconductor lasers.  |2 fast  |0 (OCoLC)fst01112170 
650 7 |a Semiconductor lasers.  |2 local 
653 |a HALBLEITERLASER + LASERDIODEN (LASERTECHNIK) 
653 |a HOCHLEISTUNGSLASER + HOCHENERGIELASER (LASERTECHNIK) 
653 |a HALBLEITERMATERIALIEN (ELEKTROTECHNIK) 
653 |a LASERBAUTEILE + MASERBAUTEILE (ELEKTROTECHNIK) 
653 |a SEMICONDUCTOR LASERS + LASER DIODES (LASER ENGINEERING) 
653 |a LASER À SEMICONDUCTEUR + DIODES LASER (TECHNIQUE DES LASERS) 
653 |a HIGH POWERED LASERS + HIGH ENERGY LASERS (LASER ENGINEERING) 
653 |a LASER DE PUISSANCE + LASER HAUTE ÉNERGIE (TECHNIQUE DES LASERS) 
653 |a MATÉRIAUX SEMICONDUCTEURS (ÉLECTROTECHNIQUE) 
653 |a SEMICONDUCTOR MATERIALS (ELECTRICAL ENGINEERING) 
653 |a ÉLÉMENTS DE LASER + ÉLÉMENTS DE MASER (ÉLECTROTECHNIQUE) 
653 |a MASER COMPONENTS + LASER COMPONENTS (ELECTRICAL ENGINEERING) 
655 4 |a Electronic books. 
776 0 8 |i Print version:  |z 9781119990338  |w (OCoLC)842314265 
856 4 0 |u https://doi.org/10.1002/9781118481882  |z Full Text via HEAL-Link 
994 |a 92  |b DG1