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05327nam a2200565 4500 |
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ocn830161625 |
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OCoLC |
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20170124070303.9 |
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m o d |
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cr cnu---unuuu |
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130316s2013 enk ob 001 0 eng d |
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|a EBLCP
|b eng
|e pn
|c EBLCP
|d YDXCP
|d DG1
|d N$T
|d IDEBK
|d OCLCF
|d OCLCQ
|d DEBSZ
|d DEBBG
|d OCLCQ
|d EBLCP
|d GrThAP
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| 020 |
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|a 9781118622582
|q (electronic bk.)
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|a 1118622588
|q (electronic bk.)
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|a 9781118621622
|q (electronic bk.)
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|a 111862162X
|q (electronic bk.)
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|a DEBBG
|b BV041906357
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|a DEBBG
|b BV043395624
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|a DEBSZ
|b 431356688
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|a NZ1
|b 15915858
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|a (OCoLC)830161625
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|a TK7872.M3
|b N3613 2013
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|a TEC
|x 008010
|2 bisacsh
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0 |
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|a 621.381531
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|a MAIN
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|a Nano-lithography /
|c edited by Stefan Landis.
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|a London :
|b Wiley,
|c 2013.
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| 300 |
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|a 1 online resource (353 pages).
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| 336 |
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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1 |
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|a ISTE
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|a Print version record.
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|a Cover; Title Page; Copyright Page; Table of Contents; 6.4.2. Three-dimensionnal AFM (AFM3D) special features; Foreword; Introduction; Chapter 1. X-ray Lithography: Fundamentals and Applications; 1.1. Introduction; 1.2. The principle of X-ray lithography; 1.2.1. The irradiation system for XRL; 1.2.2. Properties of synchrotron radiation; 1.2.3. High Resolution and Deep XRL; 1.2.4. Examples of X-ray lithography beamlines; 1.2.5. Scanner/stepper; 1.2.6. The mask; 1.3. The physics of X-ray lithography; 1.3.1. How phase and intensity of X-rays are altered by interaction with matter.
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|a 1.3.2. X-ray lithography as a shadow printing technique1.3.3. X-ray absorption in a resist and physical mechanisms involved in its exposure; 1.3.4. Physical model of electron energy loss in resists; 1.3.5. Diffraction effects in X-ray lithography; 1.3.6. Coherence of synchrotron radiation from bending magnet devices; 1.3.7. Basic formulation of diffraction theory for a scalar field; 1.3.8. Rayleigh-Sommerfeld formulation of diffraction by a planar screen; 1.3.9. An example of diffraction effects: Poisson's spot in X-ray lithography; 6.3. Scanning electron microscopy (SEM); 1.4. Applications.
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|a 1.4.1. Optimal photon energy range for high resolution and deep X-ray lithography1.4.2. Diffraction effects on proximity lithography; 1.4.3. High resolution 3D nano structuring; 1.4.4. 3D polymer structures by combination of NanoImprint (NIL) and X-ray lithography (XRL); 1.4.5. Micromachining and the LIGA process; 1.4.9. Micro-optical element for distance measurement; 1.5. Appendix 1; 1.6. Bibliography; Chapter 2. NanoImprint Lithography; 2.1. From printing to NanoImprint; 2.2. A few words about NanoImprint; 2.3. The fabrication of the mold.
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|a 2.4. Separating the mold and the resist after imprint: de-embossing2.4.1. The problem; 2.4.2. Adhesion; 2.4.3. Adhesion and physico-chemical surface properties; 2.4.4. Surface treatment of the mold; 2.4.5. Treatment of the resist; 2.4.6. Characterization of the demolding process; 2.5. The residual layer problem in NanoImprint; 2.5.1. The residual layer: a NanoImprint specific issue; 2.5.2. Is the thickness of the residual layer predictable?; 2.5.3. How can the process impact the thickness of the residual layer?; 2.6. Residual layer thickness measurement.
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|a 2.6.1. Macro-scale approach: coherence between film color and thickness2.6.2. Microscopic approach; 2.7. A few remarks on the mechanical behavior of molds and flow properties of the nanoimprint process; 2.8. Conclusion; 2.9. Bibliography; Chapter 3. Lithography Techniques Using Scanning Probe Microscopy; 3.1. Introduction; 3.2. Presentation of local-probe microscopes; 3.3. General principles of local-probe lithography techniques; 3.4. Classification of surface structuring techniques using local-probe microscopes; 3.4.1. Classification according to the physical nature of the interaction.
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|a 3.4.2. Comparison with competing advanced lithography techniques.
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|a Lithography is an extremely complex tool - based on the concept of "imprinting" an original template version onto mass output - originally using relatively simple optical exposure, masking, and etching techniques, and now extended to include exposure to X-rays, high energy UV light, and electron beams - in processes developed to manufacture everyday products including those in the realms of consumer electronics, telecommunications, entertainment, and transportation, to name but a few. In the last few years, researchers and engineers have pushed the envelope of fields including optics, physics.
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| 504 |
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|a Includes bibliographical references and index.
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| 650 |
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|a Nanolithography.
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| 650 |
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7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Circuits
|x General.
|2 bisacsh
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| 650 |
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7 |
|a Nanolithography.
|2 fast
|0 (OCoLC)fst01894717
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| 655 |
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4 |
|a Electronic books.
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| 700 |
1 |
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|a Landis, Stefan.
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| 776 |
0 |
8 |
|i Print version:
|a Landis, Stefan.
|t Nano Lithography.
|d London : Wiley, ©2013
|z 9781848212114
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| 830 |
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|a ISTE.
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| 856 |
4 |
0 |
|u https://doi.org/10.1002/9781118622582
|z Full Text via HEAL-Link
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|a 92
|b DG1
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