Materials and failures in MEMS and NEMS /

Λεπτομέρειες βιβλιογραφικής εγγραφής
Άλλοι συγγραφείς: Tiwari, Atul (Επιμελητής έκδοσης), Raj, Baldev, 1947- (Επιμελητής έκδοσης)
Μορφή: Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Hoboken, New Jersey : Salem, Massachusetts : John Wiley & Sons ; Scrivener Publishing, 2015.
Σειρά:Materials degradation and failures series
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
LEADER 05314nam a2200673 4500
001 ocn913890495
003 OCoLC
005 20170124072018.9
006 m o d
007 cr |||||||||||
008 150714s2015 nju ob 001 0 eng
010 |a  2015027730 
040 |a DLC  |b eng  |e rda  |c DLC  |d YDX  |d N$T  |d YDXCP  |d IDEBK  |d DG1  |d CDX  |d RECBK  |d COO  |d EBLCP  |d NLE  |d DEBBG  |d KSU  |d CCO  |d GrThAP 
015 |a GBB623210  |2 bnb 
019 |a 927509309  |a 932062836 
020 |a 9781119083870 (pdf) 
020 |a 1119083877 (pdf) 
020 |a 9781119083863 (epub) 
020 |a 1119083869 (epub) 
020 |z 9781119083603 (cloth : alk. paper) 
020 |a 9781119083887 
020 |a 1119083885 
020 |a 1119083605 
020 |a 9781119083603 
029 1 |a AU@  |b 000055079397 
029 1 |a GBVCP  |b 838921493 
029 1 |a DEBBG  |b BV043397944 
035 |a (OCoLC)913890495  |z (OCoLC)927509309  |z (OCoLC)932062836 
037 |a 9781119083863  |b Wiley 
042 |a pcc 
050 0 0 |a TK7875 
072 7 |a TEC  |x 009070  |2 bisacsh 
082 0 0 |a 621.381  |2 23 
049 |a MAIN 
245 0 0 |a Materials and failures in MEMS and NEMS /  |c edited by Atul Tiwari and Baldev Raj. 
264 1 |a Hoboken, New Jersey :  |b John Wiley & Sons ;  |a Salem, Massachusetts :  |b Scrivener Publishing,  |c 2015. 
300 |a 1 online resource. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
490 0 |a Materials degradation and failures series 
504 |a Includes bibliographical references and index. 
588 |a Description based on print version record and CIP data provided by publisher. 
505 0 |a ""Half Title page -- Title page -- Copyright page -- Preface -- Chapter 1: Carbon as a MEMS Material -- 1.1 Introduction -- 1.2 Structure and Properties of Glassy Carbon -- 1.3 Fabrication of C-MEMS Structures -- 1.4 Integration of C-MEMS Structures with Other Materials -- 1.5 Conclusion -- References -- Chapter 2: Intelligent Model-Based Fault Diagnosis of MEMS -- 2.1 Introduction -- 2.2 Model-Based Fault Diagnosis -- 2.3 Self-Tuning Estimation -- References -- Chapter 3: MEMS Heat Exchangers -- 3.1 Introduction"" 
505 8 |a ""3.2 Fundamentals of Thermodynamics, Fluid Mechanics, and Heat Transfer -- 3.3 MEMS Heat Sinks -- 3.4 MEMS Heat Pipes -- 3.5 Two-Fluid MEMS Heat Exchanger -- 3.6 Need for Microscale Internal Flow Passages -- Nomenclature -- Greek Alphabets -- Subscripts -- References -- Chapter 4: Application of Porous Silicon in MEMS and Sensors Technology -- 4.1 Introduction -- 4.2 Porous Silicon in Biosensors -- 4.3 Porous Silicon for Pressure Sensors -- 4.4 Conclusion -- References -- Chapter 5: MEMS/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface"" 
505 8 |a ""5.1 Introduction -- 5.2 Bi-Stable CMOS Front End Silicon Nanofin (SiNF) Switch for Non-volatile Memory Based On Van Der Waals Force -- 5.3 Vertically Actuated U-Shape Nanowire NEMS Switch -- 5.4 A Vacuum Encapsulated Si-to-Si MEMS Switch for Rugged Electronics -- 5.5 Summary -- References -- Chapter 6: On the Design, Fabrication, and Characterization of cMUT Devices -- 6.1 Introduction -- 6.2 cMUT Design and Finite Element Modeling Simulation -- 6.3 cMUT Fabrication and Characterization -- 6.4 Summary and Conclusions -- Acknowledgments -- References"" 
505 8 |a ""Chapter 7: Inverse Problems in the MEMS/NEMS Applications -- 7.1 Introduction -- 7.2 Inverse Problems in the Micro/Nanomechanical Resonators -- 7.3 Inverse Problems in the MEMS Stiction Test -- Acknowledgment -- References -- Chapter 8: Ohmic RF-MEMS Control -- 8.1 Introduction -- 8.2 Charge Drive Control (Resistive Damping) -- 8.3 Hybrid Drive Control -- 8.4 Control Under High-Pressure Gas Damping -- 8.5 Comparison between Different Control Modes -- References -- Chapter 9: Dynamics of MEMS Devices -- 9.1 Introduction -- 9.2 Modeling and Simulation"" 
505 8 |a ""9.3 Fabrication Methods -- 9.4 Characterization -- 9.5 Device Failures -- Acknowledgments -- References -- Chapter 10: Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate -- 10.1 Introduction -- 10.2 Buckling Behaviors of Constantan Wire under Electrical Loading -- 10.3 Interfacial Toughness between Constantan Wire and Polymer Substrate -- 10.4 Buckling Behaviors of Polymer Substrate Restricted by Constantan Wire -- 10.5 Conclusions -- Acknowledgments -- References"" 
506 |a Owing to Legal Deposit regulations this resource may only be accessed from within National Library of Scotland. For more information contact enquiries@nls.uk.  |5 StEdNL 
650 0 |a Microelectromechanical systems  |x Design and construction. 
650 0 |a Nanoelectromechanical systems  |x Design and construction. 
650 7 |a TECHNOLOGY & ENGINEERING / Mechanical  |2 bisacsh 
655 4 |a Electronic books. 
655 0 |a Electronic books. 
700 1 |a Tiwari, Atul,  |e editor. 
700 1 |a Raj, Baldev,  |d 1947-  |e editor. 
776 0 8 |i Print version:  |t Materials and failures in MEMS and NEMS  |d Hoboken, New Jersey : John Wiley & Sons ; Salem, Massachusetts : Scrivener Publishing, 2015  |z 9781119083603  |w (DLC) 2015025146 
856 4 0 |u https://doi.org/10.1002/9781119083887  |z Full Text via HEAL-Link 
994 |a 92  |b DG1